Following the global launch of the Xiaomi 15 Ultra at MWC 2025, a teardown video by YouTuber WekiHome has provided an inside look at the phone’s design and upgrades. The video highlights the significant space occupied by the 200MP telephoto camera, which features the Samsung ISOCELL HP9 sensor. This large camera module contributes to the PCB spanning nearly half the phone’s size.
Design and Repair Challenges
The teardown reveals that Xiaomi has removed the variable aperture present in the predecessor, replacing it with a new glass filter and enhanced algorithms to optimize camera performance. The phone’s complex assembly, including numerous screws and adhesive, makes it more challenging to repair than its predecessor. However, Xiaomi has implemented dustproof and waterproof measures for internal components like the charging port and SIM card tray.
Thermal Management and Additional Features
To improve thermal conductivity, a heat dissipation film is used to connect the main camera module and SoC area. Additionally, a larger heat sink is included to manage temperatures during extended gaming sessions. The phone also features a second set of NFC coils for smoother NFC payments. Despite these upgrades, Xiaomi has maintained a sleek design, with the phone measuring only 0.2mm thicker than its predecessor.
Availability and Pricing
The Xiaomi 15 Ultra will be available in major global markets, including Europe, in the coming weeks. It will be priced at €1,499 and will come in three colors: Black, White, and Silver Chrome. The phone’s global launch marks a significant milestone for Xiaomi, showcasing its commitment to innovative smartphone technology.