MediaTek is all set to launch its flagship Dimensity 9500 chipset, and leaked details have revealed impressive specifications that could challenge Qualcomm’s top spot.
The Dimensity 9500 will be manufactured using TSMC’s advanced N3P 3nm process, promising better power efficiency and performance. It features a unique CPU setup with 1x Cortex-X930 core clocked at 4.21 GHz, 3x Cortex-X930 cores at 3.5 GHz, and 4x Cortex-A730 cores at 2.7 GHz. This combination promises excellent speed for heavy workloads and better battery life for everyday use.
On the graphics front, the chip features a new Mali-G1-Ultra MC12 GPU that supports advanced ray-tracing for improved gaming visuals while consuming less power. MediaTek has also upgraded the AI engine with the NPU 9.0, capable of delivering a remarkable 100 TOPS (tera operations per second), which should greatly enhance AI-related tasks like photography and voice recognition.
The chipset supports up to 16 MB of L3 cache and 10 MB of system-level cache, along with support for fast 4-channel LPDDR5X RAM and UFS 4.1 storage, ensuring smooth multitasking and quick app loading.
This powerful SoC is expected to debut in devices like the Oppo Find X9 series and Vivo X300 series, with an official launch likely on September 22, 2025, a day before Qualcomm’s Snapdragon Summit. Early benchmark results have already shown strong single-core and multi-core performance, making the Dimensity 9500 a very promising contender in the flagship smartphone chip market.
MediaTek’s Dimensity 9500 is shaping up to be an affordable yet powerful alternative to Qualcomm’s best, bringing advanced features and high performance to flagship smartphones in late 2025.